Products and Services Laser etching processing equipment - MicroEtch series

MicroEtch 80

Laser etching processing equipment

产品概述
The equipment uses high-power ultrafine laser as the processing light source, equipped with AC cradle for parts clamping, mainly for the precision functional microstructure of complex three-dimensional surface parts for precision etching processing, the equipment has five axes and five linkage, surface model splicing, parallel light projection and other functions for three-dimensional model processing, can realize the non-unexpandable three-dimensional surface etching function.
功能特性
01
具备三维不可展开复杂曲面大幅面刻蚀功能;
02
具备三维模型分析及编程功能,可实现大幅面曲面图形精确分块及路径优化;
03
具备三维模型实施加工状态显示功能,可视化展示加工过程;
04
具备成熟的视觉找正测量及高精度自动测距对焦功能;
05
具有硬件异常状态监控功能,实现人机交互功能,操作简单、易用;
06
一键生成加工数据,避免人工编程,操作简单易用,整个加工过程完全自动化;
07
具有安全互锁功能,防止激光加工过程中安全门开启伤害人身安全;
08
具备吹气及烟尘净化功能。
参数指标
Free travel X/Y/Z(mm)800/500/450
Positioning accuracy X/Y/Z (mm)0.015
Repeatability X/Y/Z (mm)0.010

Stroke A/C (°)

±110/0-360
Positioning accuracy A/C (arcseconds)15
Repeatability A/C (arcseconds)10
Pulse width (fs)<290
Average power (w)20
Maximum workpiece rotary diameter (mm)Φ200
Worktable load capacity (kg)20
Maximum curved workpiece size (mm)Φ200X200
Maximum flat workpiece size (mm)700X400(Special fixtures required)
Scanning area etching accuracy (mm)±0.02
Machine weight (t)About 8

Equipment footprint dimensions (mm) (WxDxH)

4750X4200X2600
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