Products and Services Laser etching processing equipment - MicroEtch series

MicroEtch 200L

Large-scale 3D surface laser etching equipment

产品概述
The equipment uses high-power ultrafine laser as the processing light source, based on the three-axis fixed gantry host, equipped with optical double pendulum axis core components, mainly for the precision functional micro-structure of the surface of large complex three-dimensional curved parts for precision etching processing, the equipment has five axes and five linkage, surface model splicing, parallel light projection and other functions. It can realize 3D model processing and 3D surface etching.
功能特性
01
具备三维不可展开大型复杂曲面大幅面刻蚀功能;
02
具备三维模型分析及编程功能,可实现大幅面曲面图形精确分块及路径优化;
03
具备三维模型实施加工状态显示功能,可视化展示加工过程;
04
具备成熟的视觉找正测量及高精度自动测距对焦功能;
05
具备防碰撞功能,保证加工过程安全性;
06
具有硬件异常状态监控功能,实现人机交互功能,操作简单、易用;
07
一键生成加工数据,避免人工编程,操作简单易用,整个加工过程完全自动化;
08
具有安全互锁功能,防止激光加工过程中安全门开启伤害人身安全;
09
具备吹气及烟尘净化功能。
参数指标
X/Y/Z free travel (mm)2000/1600/800
X/Y/Z positioning accuracymm)0.02
X/Y/Z axis repeatability(mm)0.01
A/C axis travel(°)±110/0-360
A/C axis positioning accuracy(″)15
A/C axis repeatability(″)10
Pulse width(ps)1-5
Average power(w)50

Maximum workpiece size (cylinder)(mm)

Φ900x800
Single-frame etching accuracy(mm)±0.02
Machine weight(t)约25
Equipment footprint dimensions (mm) (WxDxH)4100X6200X4500
Worktable dimensions (LxW) (mm)2000X1400
Table load (kg)3000
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