| Processing area (single track) (mm) | 450X330 |
| Processing area (dual track) (mm) | 200X200 |
| Processing method (/) | Online |
| Platform positioning accuracy(μm) | ±3 |
| Marking accuracy(mm) | ±0.1 |
| Output wavelength(nm) | 355 |
| Laser average power(w) | 5 |
| Laser cooling mode(/) | Air-cooled |
| Recommended maximum cutting thickness(mm) | 1 |
| Accepted file types(/) | DXF |
| Main body dimensions (mm) (WxDxH) | 880X1450X1650 |
| Host machine weight (kg) | 1550 |
| Power supply (/) | AC220V/3KW |
| Ambient temperature(℃) | Room temperature18℃-25℃ |
| Ambient humidity(/) | 30%-75%,No condensation |
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