Solutions Laser etching process
Laser etching processSolutions
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Scheme overview
Targeting high-precision processing needs for complex curved surfaces and microstructures in metals and non-metals for aerospace applications, we offer advanced precision processing services and complete solutions, including nanosecond, picosecond, and femtosecond lasers.
  • 01
    Processing of microstructures on the inner and outer walls of 3D circuitry
  • 02
    Coating grid line, microstructure processing
  • 03
    Laser roughening of large aluminum alloy shell
  • 04
    Glass fiber surface coating etching
Results Display
  • Laser coating of metal surface

    Taper:Zero taper

    maximum roughness up to Ra15

    maximum roughness up to Ra15

    maximum roughness up to Ra15

    no remelting layer

  • Laser texturing of composite material surfaces

    Laser processing of woven composite surfaces

    Exposing the fiberglass layer

    No damage to the glass substrate

    The base material has no black carbonization

  • Resonance microstructure etching

    The base material has no black carbonization

    etching damage≤30μm

    Machining accuracy±0.01mm

    Minimum machining size0.1mm

    Minimum machining size0.1mm

    the coating does not fall off and the substrate does not blackened and carbonized

  • Resonance microstructure etching

    the coating does not fall off and the substrate does not blackened and carbonized

    the coating does not fall off and the substrate does not blackened and carbonized

    substrate damage≤30μm

    Machining accuracy±0.01mm

    Minimum machining size0.1mm

    The substrate has no blackness and no carbonization

  • Resonance microstructure etching

    The substrate has no blackness and no carbonization

    The substrate has no blackness and no carbonization

    substrate damage≤5μm

    Machining accuracy±0.01mm

    Minimum machining size0.1mm

    Minimum machining size0.1mm

    no carbonization of glass fiber

  • Resonance microstructure etching

    Machining accuracy±0.01mm

    Minimum machining size0.1mm

    Minimum machining size0.1mm

    Minimum machining size0.1mm

    composite material undamaged

  • Friction ring etching

    Etching depth5±1μm

    Machining accuracy±0.01mm

    Depth accuracy±0.005mm

    Depth accuracy±0.005mm

    Depth accuracy±0.005mm

    Depth accuracy±0.005mm

    no remelting layer

  • Cutting of hemispherical metal shielding covers

    Metal thickness0.3mm、0.1mm

    Part sizeφ300mm

    Altitude180mm

    Single bit size1.18mm

    Machining accuracy±0.01mm

    Minimum machining size0.1mm

    No burrs and no carbonization after cutting

  • Special coating microstructure scribing

    No burrs and no carbonization after cutting

    No burrs and no carbonization after cutting

    No burrs and no carbonization after cutting

    No burrs and no carbonization after cutting

    Gy laser processing line width≤0.02mm

    Depth of processing≤0.01mm

    Distance between lines0.2±0.005mm

    Distance between lines0.2±0.005mm

    Distance between lines0.2±0.005mm

    black

Industry Applications
  • aviation

  • spaceflight

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